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Ultimate-low-k SiOCH film (k=3D1.3) with sufficient modulus (>5 GPa) and ultra-high thermal stability formed by low-temperature pulse-time-modulated neutral-beam-enhanced CVD

Ultimate-low-k SiOCH film (k=3D1.3) with sufficient modulus (>5 GPa) and ultra-high thermal stability formed by low-temperature pulse-time-modulated neutral-beam-enhanced CVD, Interconnect Technology Conference (IITC), 2010 International, Yasuhara, S. ; Inst. of Fluid Sci., Tohoku Univ., Sendai, Japan ;    Sasaki, T. ;    Shimayama, T. ;    Tajima, K. more authors