Ultimate-low-k SiOCH film (k=3D1.3) with sufficient modulus (>5 GPa) and ultra-high thermal stability formed by low-temperature pulse-time-modulated neutral-beam-enhanced CVD, Interconnect Technology Conference (IITC), 2010 International, Yasuhara, S. ; Inst. of Fluid Sci., Tohoku Univ., Sendai, Japan ; Sasaki, T. ; Shimayama, T. ; Tajima, K. more authors
