Ultimate-low-k SiOCH film (k=3D1.3) with sufficient modulus (>5 GPa) and ultra-high thermal stability forme …Read More >>
Category Archives: 学会発表（国際）
Structure-Designable Formation-Method of Super Low-k SiOC Film (k=2.2) by Neutral-Beam-Enhanced-CVD
Structure-Designable Formation-Method of Super Low-k SiOC Film (k=2.2) by Neutral-Beam-Enhanced-CVD, Interconn …Read More >>
Tribological characterization of boron nitride films against
Tribological characterization of boron nitride films against, 11th International Conference on Technology of P …Read More >>
Fabrication and Investigation of new amino-silane precursor(BEMAS) for low temperature deposition of SiO and SiN
Fabrication and Investigation of new amino-silane precursor(BEMAS) for low temperature deposition of SiO and S …Read More >>
A method of forming Si-CH2 in low-k SiC barrier dielectrics using BTMSA (Bis-trim ethylsilylacetylene)
A method of forming Si-CH2 in low-k SiC barrier dielectrics using BTMSA (Bis-trim ethylsilylacetylene), ADMETA …Read More >>