JAC’s recent study was published in “ACS Omega”. [ACS Omega 2 1523 (2017)]
The influences of filament temperature on the structure of boron nitride films and its tribological characterization for microforming die application, Manufacturing Rev. Volume 2, 2015, Article No.4, P6, Yong Jin, Shigeo Yasuhara, Tetsuhide Shimizu and Ming Yang.
Super-low-k SiOCH film (k = 1.9) with extremely high water resistance and thermal stability formed by neutral-beam-enhanced CVD, Shigeo Yasuhara et al 2010 J. Phys. D: Appl. Phys. 43 065203
Impact of film structure on damage to low-k SiOCH film during plasma exposure, Shigeo Yasuhara et al 2009 J. Phys. D: Appl. Phys. 42 235201
Tribological Characterization of Boron Nitride Films against Pure-titanium for Microforming die Application, Procedia Engineering Volume 81, 2014, Pages 1909–1914, 11th International Conference on Technology of Plasticity, ICTP 2014, 19-24 October 2014, Nagoya Congress Center, Nagoya, Japan, Yong Jin, Shigeo Yasuhara, Tetsuhide Shimizu, Ming Yang